physical sputtering

简明释义

物理溅射

英英释义

例句

1.During physical sputtering, high-energy ions bombard a target material, ejecting atoms.

在物理溅射过程中，高能离子轰击目标材料，弹出原子。

2.Researchers studied the effects of physical sputtering on the surface morphology of metals.

研究人员研究了物理溅射对金属表面形态的影响。

3.In semiconductor manufacturing, physical sputtering is used to deposit thin films on substrates.

在半导体制造中，物理溅射用于在基材上沉积薄膜。

4.The physical sputtering process can create a uniform coating on various materials.

该物理溅射过程可以在各种材料上形成均匀涂层。

5.The efficiency of physical sputtering can be influenced by the angle of incidence of the ions.

离子的入射角会影响物理溅射的效率。

作文

In the field of materials science and engineering, various techniques are employed to modify surfaces for improved performance. One such technique is known as physical sputtering, which is a process that involves the ejection of atoms from a solid target material due to bombardment by energetic particles. This method has gained significant attention due to its ability to produce thin films and coatings with desirable properties. Understanding physical sputtering is essential for researchers and engineers who aim to enhance material characteristics, such as hardness, corrosion resistance, and electrical conductivity.The physical sputtering process typically begins when a target material is bombarded by high-energy ions, often generated from a plasma or an ion beam. When these ions collide with the surface of the target, they transfer energy to the atoms within the material. If the energy transferred is sufficient, it can overcome the binding energy of the atoms, leading to their ejection from the surface. This phenomenon is crucial because it allows for the deposition of material onto a substrate, which can be used in various applications, including semiconductor manufacturing, optical coatings, and decorative finishes.One of the main advantages of physical sputtering is its versatility. It can be applied to a wide range of materials, including metals, insulators, and semiconductors. Additionally, the process can be controlled to achieve specific film thicknesses and compositions, making it a valuable tool in the fabrication of advanced materials. For instance, in the electronics industry, physical sputtering is often used to deposit thin layers of conductive metals onto silicon wafers, which are essential for creating integrated circuits.Moreover, the physical sputtering technique can be performed in different environments, such as vacuum chambers or reactive atmospheres, allowing for the creation of diverse material properties. The ability to tailor the deposition conditions enables researchers to engineer surfaces with unique functionalities, such as superhydrophobicity or enhanced adhesion.However, like any technology, physical sputtering also has its challenges. One of the primary concerns is the potential for damage to the target material during the sputtering process. The energetic ions not only eject atoms but can also displace them within the target, leading to defects that may affect the overall quality of the deposited film. Additionally, controlling the uniformity of the coating can be difficult, especially over large areas, which is critical for many industrial applications.In conclusion, physical sputtering is a fundamental technique in the realm of materials science that facilitates the modification of surfaces for various applications. By understanding the mechanisms and implications of this process, researchers and engineers can continue to innovate and improve material performance. As technology advances, the role of physical sputtering is likely to expand, paving the way for new applications and enhancements in multiple fields, from electronics to nanotechnology.

在材料科学与工程领域，各种技术被用来修改表面，以提高性能。其中一种技术被称为物理溅射，这是一种由于高能粒子的轰击而导致固体靶材中原子被喷射的过程。这种方法因其能够生产具有理想特性的薄膜和涂层而受到广泛关注。理解物理溅射对那些旨在增强材料特性（如硬度、耐腐蚀性和电导率）的研究人员和工程师来说至关重要。物理溅射过程通常始于靶材被高能离子轰击，这些离子通常来自等离子体或离子束。当这些离子与靶材表面碰撞时，它们将能量传递给材料中的原子。如果传递的能量足够，它可以克服原子的结合能，导致它们从表面喷射出去。这一现象至关重要，因为它允许将材料沉积到基底上，这可以用于各种应用，包括半导体制造、光学涂层和装饰性涂层。物理溅射的主要优点之一是其多功能性。它可以应用于多种材料，包括金属、绝缘体和半导体。此外，该过程可以控制以实现特定的薄膜厚度和成分，使其成为制造先进材料的宝贵工具。例如，在电子行业中，物理溅射常用于将导电金属薄层沉积到硅晶圆上，这对于创建集成电路至关重要。此外，物理溅射技术可以在不同的环境中进行，例如真空室或反应气氛中，从而允许创建多样化的材料性能。调整沉积条件的能力使研究人员能够设计具有独特功能的表面，例如超疏水性或增强粘附性。然而，像任何技术一样，物理溅射也面临着挑战。其中一个主要问题是在溅射过程中靶材可能受到损伤。高能离子不仅喷射原子，还可能在靶材内位移它们，导致缺陷，这可能影响沉积薄膜的整体质量。此外，控制涂层的均匀性可能很困难，特别是在大面积上，这对于许多工业应用至关重要。总之，物理溅射是材料科学领域的一项基本技术，促进了各种应用的表面修改。通过理解这一过程的机制和影响，研究人员和工程师可以继续创新和改善材料性能。随着技术的进步，物理溅射的角色可能会扩展，为多个领域的新应用和增强铺平道路，从电子到纳米技术。