solderability

简明释义

英[ˌsɒldərəˈbɪlɪti]美[ˌsɑːdərəˈbɪlɪti]

n. 可焊性；软焊性

英英释义

单词用法

同义词

反义词

例句

1.And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.

同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。

2.In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.

为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。

3.The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

4.Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.

利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。

5.The solderability of electronic solders and some factors that influence the solderability are discussed.

在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。

6.Nickel and tin are plated to an aluminum surface possessing solderability and superb conductivity.

镍和锡镀上铝制表面，具备可焊性和卓越的传导性。

7.High solderability due to specially plated electrodes.

具高可焊性特殊电极端子。

8.Before soldering, it's important to check the solderability of the metal surfaces.

在焊接之前，检查金属表面的可焊性是很重要的。

9.Poor solderability can lead to weak joints and potential failures in electronic devices.

差的可焊性可能导致电子设备中的弱连接和潜在故障。

10.The manufacturer tested the solderability of the new circuit boards to ensure they would perform well in production.

制造商测试了新电路板的可焊性，以确保它们在生产中表现良好。

11.The solderability of the lead-free solder was compared to traditional solders in a recent study.

最近的一项研究比较了无铅焊料与传统焊料的可焊性。

12.High solderability is crucial for components that will be used in high-frequency applications.

高可焊性对于将在高频应用中使用的组件至关重要。

作文

Soldering is a crucial process in electronics, where components are connected to a circuit board using a molten metal alloy. One of the key factors that determine the quality and reliability of solder joints is the material's solderability, which refers to the ability of a metal surface to be effectively joined by solder. This property is vital for ensuring that electronic devices function correctly and have a long lifespan. The concept of solderability encompasses several aspects, including the wetting ability of the solder, the cleanliness of the surfaces being joined, and the temperature conditions during the soldering process. A surface with good solderability allows the solder to flow smoothly and form a strong bond with the metal, creating a reliable electrical connection. In contrast, poor solderability can lead to weak joints that may fail over time, resulting in device malfunctions or complete failures.To improve solderability, manufacturers often apply various surface finishes to components and circuit boards. These finishes can include gold, silver, or tin coatings, which enhance the wettability of the surfaces and protect them from oxidation. For instance, a gold finish provides excellent solderability due to its resistance to corrosion and oxidation, allowing for reliable solder joints.Moreover, the selection of solder material itself plays a significant role in achieving optimal solderability. Different solder alloys have varying melting points, fluidity, and adhesion properties. For example, lead-free solders, which are increasingly used due to environmental regulations, may require higher temperatures and specific fluxes to ensure good solderability. Thus, understanding the interactions between solder materials and the surfaces being joined is essential for achieving the best results.In addition to the physical properties of the materials involved, the soldering technique also affects solderability. Techniques such as wave soldering, reflow soldering, and hand soldering each have their unique requirements and applications. Proper training and skill development for technicians are necessary to ensure that they can effectively assess and enhance solderability during the assembly process.Testing solderability is equally important in the manufacturing process. Various methods, such as the wetting balance test and the dip solder test, are employed to evaluate how well a surface can be soldered. These tests help manufacturers identify any potential issues before mass production, thus preventing costly defects in electronic assemblies.In conclusion, solderability is a fundamental aspect of electronic manufacturing that directly impacts the performance and reliability of electronic devices. By understanding the factors that influence solderability, including surface finishes, solder materials, and soldering techniques, manufacturers can produce high-quality products that meet the demands of modern technology. As electronics continue to evolve, maintaining high standards of solderability will remain a priority to ensure the longevity and functionality of devices in an increasingly complex world.

焊接是电子学中一个至关重要的过程，其中元件通过熔融金属合金连接到电路板上。决定焊点质量和可靠性的关键因素之一是材料的可焊性，即金属表面被焊料有效连接的能力。这个特性对于确保电子设备正常工作和拥有较长使用寿命至关重要。可焊性的概念包括多个方面，包括焊料的润湿能力、被连接表面的清洁度以及焊接过程中的温度条件。具有良好可焊性的表面允许焊料顺利流动，并与金属形成强有力的结合，从而创造出可靠的电气连接。相反，较差的可焊性可能导致弱焊点，随着时间的推移可能会失效，从而导致设备故障或完全失效。为了提高可焊性，制造商通常会对元件和电路板应用各种表面处理。这些处理可以包括金、银或锡涂层，它们增强了表面的润湿性并保护其免受氧化。例如，金涂层由于其抗腐蚀和抗氧化的特性，提供了优异的可焊性，使得焊点更加可靠。此外，焊料材料的选择在实现最佳可焊性方面也起着重要作用。不同的焊料合金具有不同的熔点、流动性和附着力。例如，由于环境法规，越来越多地使用无铅焊料，这些焊料可能需要更高的温度和特定的助焊剂来确保良好的可焊性。因此，理解焊料材料与被连接表面之间的相互作用对于获得最佳结果至关重要。除了材料的物理特性外，焊接技术也会影响可焊性。波峰焊、回流焊和手工焊接等技术各有其独特的要求和应用。技术人员的适当培训和技能发展是必要的，以确保他们能够有效评估和增强组装过程中的可焊性。测试可焊性在制造过程中同样重要。各种方法，如润湿平衡测试和浸焊测试，被用来评估表面焊接的效果。这些测试帮助制造商在大规模生产之前识别潜在问题，从而防止电子组件中的昂贵缺陷。总之，可焊性是电子制造的基本方面，直接影响电子设备的性能和可靠性。通过理解影响可焊性的因素，包括表面处理、焊料材料和焊接技术，制造商可以生产出符合现代技术需求的高质量产品。随着电子产品的不断发展，保持高标准的可焊性仍将是确保设备在日益复杂的世界中持久性和功能性的优先事项。