three dimensional integrated circuit

简明释义

三维集成电路

英英释义

例句

1.The development of three dimensional integrated circuit has revolutionized the electronics industry.

三维集成电路的发展已经彻底改变了电子行业。

2.The three dimensional integrated circuit allows for greater functionality in a smaller footprint.

三维集成电路允许在更小的空间内实现更大的功能。

3.Researchers are exploring new materials for three dimensional integrated circuit fabrication.

研究人员正在探索用于三维集成电路制造的新材料。

4.Many modern smartphones utilize three dimensional integrated circuit technology to enhance performance.

许多现代智能手机利用三维集成电路技术来提升性能。

5.Engineers are working on improving the efficiency of three dimensional integrated circuit designs.

工程师们正在努力提高三维集成电路设计的效率。

作文

In the rapidly advancing world of technology, the demand for more efficient and compact electronic devices is ever-increasing. One of the most promising innovations in this field is the development of three dimensional integrated circuits (三维集成电路). Unlike traditional two-dimensional integrated circuits that stack components side by side, three dimensional integrated circuits allow for vertical stacking of components, significantly enhancing performance and reducing space requirements.The concept of three dimensional integrated circuits involves layering multiple circuit layers on top of one another, which not only saves space but also reduces the distance that signals need to travel. This shorter pathway results in faster data transmission and improved energy efficiency. As electronic devices become increasingly complex, the limitations of two-dimensional designs become apparent. The introduction of three dimensional integrated circuits addresses these challenges by enabling higher density and performance without the need for larger physical sizes.Moreover, three dimensional integrated circuits can integrate various functionalities into a single chip. For example, they can combine logic, memory, and analog functions, which traditionally required separate chips. This integration leads to reduced manufacturing costs and improved reliability, as fewer components mean fewer points of failure. Additionally, the compact design of three dimensional integrated circuits allows for better thermal management, which is crucial in high-performance applications where overheating can lead to device failure.The applications of three dimensional integrated circuits are vast and varied. They are particularly beneficial in the fields of mobile computing, high-performance computing, and Internet of Things (IoT) devices. In mobile devices, for instance, the reduced size and weight of three dimensional integrated circuits contribute to sleeker designs and longer battery life. Similarly, in data centers, these circuits can help improve processing power while minimizing energy consumption, which is a critical factor in managing operational costs.Despite their numerous advantages, the adoption of three dimensional integrated circuits is not without challenges. The manufacturing processes involved in creating these circuits are more complex than those for traditional ICs. Issues such as heat dissipation, interconnect reliability, and the need for advanced packaging technologies must be addressed. As research and development continue, however, it is expected that these challenges will be overcome, paving the way for more widespread use of three dimensional integrated circuits.In conclusion, the advent of three dimensional integrated circuits marks a significant milestone in the evolution of electronic devices. Their ability to enhance performance, reduce size, and integrate multiple functions offers a glimpse into the future of technology. As we move towards an increasingly interconnected world, the role of three dimensional integrated circuits will undoubtedly become more prominent, driving innovation and shaping the landscape of electronic design for years to come.

在快速发展的技术世界中，对更高效和紧凑的电子设备的需求日益增加。其中一个最有前景的创新就是三维集成电路（three dimensional integrated circuits）的发展。与传统的二维集成电路将组件并排堆叠不同，三维集成电路允许组件垂直堆叠，从而显著提高性能并减少空间需求。三维集成电路的概念涉及将多个电路层层叠放在一起，这不仅节省了空间，还减少了信号传输的距离。这一较短的路径导致了更快的数据传输和更高的能效。随着电子设备变得越来越复杂，二维设计的局限性变得显而易见。三维集成电路的引入解决了这些挑战，通过在不需要更大物理尺寸的情况下实现更高的密度和性能。此外，三维集成电路可以将各种功能集成到单个芯片中。例如，它们可以将逻辑、存储器和模拟功能结合起来，而这些功能传统上需要单独的芯片。这种集成降低了制造成本，提高了可靠性，因为组件减少意味着故障点也减少。此外，三维集成电路的紧凑设计有助于更好的热管理，这在高性能应用中至关重要，因为过热可能导致设备故障。三维集成电路的应用广泛而多样。它们在移动计算、高性能计算和物联网（IoT）设备领域特别有利。在移动设备中，例如，三维集成电路的尺寸和重量减少有助于更流线型的设计和更长的电池寿命。同样，在数据中心，这些电路可以帮助提高处理能力，同时最小化能耗，这在管理运营成本方面是一个关键因素。尽管有众多优势，但三维集成电路的采用并非没有挑战。制造这些电路所涉及的工艺比传统IC更复杂。诸如热散发、互连可靠性以及对先进封装技术的需求等问题必须得到解决。然而，随着研究和开发的继续，预计这些挑战将会被克服，为三维集成电路的更广泛使用铺平道路。总之，三维集成电路的出现标志着电子设备演变中的一个重要里程碑。它们增强性能、减少尺寸和集成多种功能的能力为技术的未来提供了一瞥。随着我们走向一个日益互联的世界，三维集成电路的角色无疑将更加突出，推动创新，并在未来几年塑造电子设计的格局。