surface mounted assembly

简明释义

表面装配

英英释义

例句

1.The surface mounted assembly allows for quick installation without the need for additional framing.

该表面安装组件允许快速安装，无需额外的框架。

2.During the installation, ensure that the surface mounted assembly is securely attached to the wall.

在安装过程中，确保表面安装组件牢固地固定在墙上。

3.Our design includes a surface mounted assembly for the control panel to simplify access.

我们的设计包括一个表面安装组件用于控制面板，以简化访问。

4.The technician recommended a surface mounted assembly for easier maintenance in the future.

技术人员建议使用表面安装组件以便于今后的维护。

5.The new lighting system uses a surface mounted assembly to save space and improve aesthetics.

新的照明系统使用表面安装组件来节省空间并改善美观。

作文

In the world of electronics, the term surface mounted assembly refers to a method of mounting electronic components directly onto the surface of printed circuit boards (PCBs). This technique has revolutionized the way electronic devices are designed and manufactured. Unlike traditional through-hole technology, where components are inserted into drilled holes in the PCB, surface mounted assembly allows for a more compact and efficient design. This is particularly important in today's market, where consumers demand smaller, lighter, and more powerful devices.The advantages of surface mounted assembly are numerous. Firstly, it enables higher component density on the PCB. Manufacturers can place components closer together, which not only saves space but also improves the electrical performance of the device. Additionally, this method allows for automated assembly processes, increasing production speed and reducing labor costs. As a result, many companies have transitioned to surface mounted assembly for their manufacturing needs.Another significant benefit of surface mounted assembly is its contribution to the overall reliability of electronic products. The components used in this assembly method are generally smaller and lighter, which reduces the mechanical stress on the solder joints during operation. This leads to a lower failure rate and longer lifespan for the devices produced using this technique.However, the transition to surface mounted assembly is not without its challenges. One major issue is that the components must be carefully selected to ensure compatibility with the assembly process. This includes considering factors such as size, weight, and thermal characteristics. Moreover, the soldering process used in surface mounted assembly requires precise control of temperature and time to avoid damaging the components or the PCB itself.Despite these challenges, the industry continues to embrace surface mounted assembly due to its clear benefits. For instance, smartphones, tablets, and other portable devices heavily rely on this technology to achieve their sleek designs and high performance. As technology advances, we can expect to see even more innovations in surface mounted assembly, including the development of new materials and techniques that further enhance the capabilities of electronic devices.In conclusion, surface mounted assembly is a crucial aspect of modern electronics manufacturing. Its advantages in terms of size, efficiency, and reliability make it the preferred choice for many companies. As the demand for smaller and more powerful devices continues to grow, the importance of mastering surface mounted assembly will only increase. Understanding this technology is essential for anyone looking to pursue a career in electronics or related fields. By embracing the principles of surface mounted assembly, we can continue to push the boundaries of what is possible in electronic design and innovation.

在电子世界中，术语表面贴装组件指的是将电子元件直接安装到印刷电路板（PCB）表面的一种方法。这项技术彻底改变了电子设备的设计和制造方式。与传统的穿孔技术不同，在穿孔技术中，元件被插入到PCB上钻好的孔中，而表面贴装组件则允许更紧凑和高效的设计。在今天的市场上，消费者要求设备更小、更轻、更强大，这一点尤为重要。表面贴装组件的优点是众多的。首先，它允许PCB上更高的元件密度。制造商可以将元件放置得更近，这不仅节省了空间，还提高了设备的电气性能。此外，这种方法还允许自动化组装过程，从而提高生产速度并降低劳动成本。因此，许多公司已转向表面贴装组件以满足其制造需求。表面贴装组件的另一个显著好处是其对电子产品整体可靠性的贡献。使用这种组装方法的元件通常更小、更轻，这减少了在操作过程中对焊点的机械压力。这导致故障率降低，使用这种技术制造的设备寿命更长。然而，向表面贴装组件过渡并非没有挑战。一个主要问题是必须仔细选择组件，以确保与组装过程的兼容性。这包括考虑尺寸、重量和热特性等因素。此外，表面贴装组件中使用的焊接过程需要精确控制温度和时间，以避免损坏组件或PCB本身。尽管存在这些挑战，行业仍然继续接受表面贴装组件，因为其明显的好处。例如，智能手机、平板电脑和其他便携式设备在很大程度上依赖这项技术来实现其流线型设计和高性能。随着技术的进步，我们可以期待看到更多关于表面贴装组件的创新，包括开发新材料和技术，进一步增强电子设备的能力。总之，表面贴装组件是现代电子制造的重要方面。它在尺寸、效率和可靠性方面的优势使其成为许多公司的首选。随着对更小、更强大设备的需求不断增长，掌握表面贴装组件的重要性只会增加。了解这项技术对于任何希望在电子或相关领域追求职业的人来说都是至关重要的。通过接受表面贴装组件的原则，我们可以继续推动电子设计和创新的可能性界限。