active substrate trimming

简明释义

有源衬底蝶

英英释义

例句

1.Our team is researching active substrate trimming techniques for better thermal management in electronics.

我们的团队正在研究用于电子设备更好热管理的主动基材修剪技术。

2.The new manufacturing process incorporates active substrate trimming to minimize material waste.

新的制造过程结合了主动基材修剪以最小化材料浪费。

3.The engineers implemented active substrate trimming to enhance the performance of the circuit board.

工程师们实施了主动基材修剪以提升电路板的性能。

4.In the latest update, the software supports active substrate trimming for improved efficiency.

在最新的更新中，软件支持主动基材修剪以提高效率。

5.By using active substrate trimming, we can reduce the overall weight of the device significantly.

通过使用主动基材修剪，我们可以显著减少设备的整体重量。

作文

In the field of electronics and materials science, the concept of active substrate trimming plays a crucial role in enhancing the performance and efficiency of various devices. This term refers to the process of adjusting or modifying the substrate material actively during the manufacturing or operational phases of electronic components. Substrates serve as the foundational layer for electronic circuits, and their properties can significantly impact the overall functionality of the device. Therefore, understanding active substrate trimming is essential for engineers and researchers aiming to optimize electronic systems.The significance of active substrate trimming lies in its ability to fine-tune the electrical and thermal characteristics of substrates. By actively altering the substrate properties, manufacturers can achieve better signal integrity, reduced power consumption, and improved thermal management. This is particularly important in high-frequency applications where even minor variations in substrate properties can lead to substantial performance degradation. For instance, in radio frequency (RF) devices, maintaining the right dielectric constant and loss tangent is critical for effective signal transmission.Moreover, active substrate trimming allows for greater flexibility in the design and fabrication processes. Traditional methods often involve passive trimming techniques, which can be time-consuming and less efficient. In contrast, active trimming enables real-time adjustments, allowing engineers to respond quickly to changes in design requirements or material behavior. This adaptability not only accelerates the production timeline but also enhances the overall quality of the final product.In recent years, advances in technology have further propelled the importance of active substrate trimming. With the rise of complex multi-layered circuits and the miniaturization of electronic components, the demand for precise control over substrate characteristics has grown exponentially. Innovations such as laser trimming and chemical etching are now being employed to achieve the desired substrate modifications actively. These techniques enable manufacturers to create highly specialized substrates tailored to specific applications, thus driving the development of next-generation electronic devices.Additionally, active substrate trimming has implications beyond just performance enhancements. It also contributes to sustainability in electronics manufacturing. By optimizing substrate use and reducing waste through precise modifications, manufacturers can minimize their environmental footprint. This aspect is becoming increasingly important in an industry that is under pressure to adopt greener practices.In conclusion, active substrate trimming is a vital concept in the realm of electronics that encompasses the active modification of substrate materials to enhance device performance. Its ability to improve signal integrity, provide design flexibility, and promote sustainability makes it a key focus area for engineers and researchers alike. As technology continues to evolve, the relevance of active substrate trimming will only increase, paving the way for more efficient and advanced electronic systems in the future.

在电子和材料科学领域，主动基材修整的概念在增强各种设备的性能和效率方面发挥着至关重要的作用。这个术语指的是在电子组件的制造或操作阶段，主动调整或修改基材材料的过程。基材作为电子电路的基础层，其特性可以显著影响设备的整体功能。因此，理解主动基材修整对于旨在优化电子系统的工程师和研究人员来说至关重要。主动基材修整的重要性在于其能够微调基材的电气和热特性。通过主动改变基材特性，制造商可以实现更好的信号完整性、降低功耗和改善热管理。这在高频应用中尤为重要，因为即使是微小的基材特性变化也会导致显著的性能下降。例如，在射频（RF）设备中，保持合适的介电常数和损耗正切对于有效的信号传输至关重要。此外，主动基材修整还允许在设计和制造过程中具有更大的灵活性。传统方法通常涉及被动修整技术，这可能耗时且效率较低。相比之下，主动修整能够实时调整，使工程师能够快速响应设计要求或材料行为的变化。这种适应性不仅加快了生产时间表，还提高了最终产品的整体质量。近年来，技术的进步进一步推动了主动基材修整的重要性。随着复杂多层电路的兴起和电子元件的小型化，对基材特性精确控制的需求呈指数增长。激光修整和化学蚀刻等创新技术现在被用于主动实现所需的基材修改。这些技术使制造商能够创建高度专业化的基材，以针对特定应用，从而推动下一代电子设备的发展。此外，主动基材修整不仅对性能提升有影响。它还促进了电子制造中的可持续性。通过优化基材的使用和通过精确修改减少废物，制造商可以最小化其环境足迹。在一个面临采用更环保实践压力的行业中，这一方面变得越来越重要。总之，主动基材修整是电子领域的一个重要概念，涵盖了主动修改基材材料以增强设备性能的过程。其改善信号完整性、提供设计灵活性和促进可持续性的能力使其成为工程师和研究人员的重点关注领域。随着技术的不断发展，主动基材修整的相关性只会增加，为未来更高效和先进的电子系统铺平道路。